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ISTQB CTFL CERTIFICATION EXAM SAMPLE QUESTIONS QUESTIONS AND ANSWERS 2024/2025
01. Which of the following is a project risk? 
a) Skill and staff shortages 
b) Poor software characteristics (e.g. usability) 
c) Failure-prone software delivered 
d) Possible reliability defect (bug) 
→ Answer: 
→ 
→ a) Skill and staff shortages 
02. Which of these tasks would you expect to be performed during the Test Analysis and 
Design phase of the Fundamental Test Process? 
a) Defining test objectives 
b) Reviewing the test basis 
c) Creating test suites from test procedures 
d) A...
- Exam (elaborations)
- • 3 pages •
01. Which of the following is a project risk? 
a) Skill and staff shortages 
b) Poor software characteristics (e.g. usability) 
c) Failure-prone software delivered 
d) Possible reliability defect (bug) 
→ Answer: 
→ 
→ a) Skill and staff shortages 
02. Which of these tasks would you expect to be performed during the Test Analysis and 
Design phase of the Fundamental Test Process? 
a) Defining test objectives 
b) Reviewing the test basis 
c) Creating test suites from test procedures 
d) A...
ISTQB 1: FUNDAMENTALS OF TESTING QUESTIONS AND ANSWERS 2024/2025
Risk 
→ A factor that could result in future negative consequences, usually expressed as impact 
or likelihood. 
Error (mistake) 
→ A human action that produces an incorrect result. 
Defect (bug, fault) 
→ A flaw in a component or system that can cause the component or system to fail to 
perform its required function. 
→ E.g. an incorrect statement or data definition. A defect if encountered during 
execution, may cause a failure of the component or system. 
Failure 
→ Deviation of ...
- Exam (elaborations)
- • 6 pages •
Risk 
→ A factor that could result in future negative consequences, usually expressed as impact 
or likelihood. 
Error (mistake) 
→ A human action that produces an incorrect result. 
Defect (bug, fault) 
→ A flaw in a component or system that can cause the component or system to fail to 
perform its required function. 
→ E.g. an incorrect statement or data definition. A defect if encountered during 
execution, may cause a failure of the component or system. 
Failure 
→ Deviation of ...
ISTQB QUESTIONS AND ANSWERS 2024/2025
Which of the problems below BEST characterize a result of software failure 
→ Damaged reputation 
What should be taken into account to determine when to stop testing 
→ technical risk, business risk, project constraints 
What is the process of analyzing and removing causes of failures in software 
→ debugging 
Which of the following are MAJOR test implementation and execution tasks 
→ repeating test activities, creating test suites, reporting discrepancies, logging the 
outcome 
What pr...
- Exam (elaborations)
- • 12 pages •
Which of the problems below BEST characterize a result of software failure 
→ Damaged reputation 
What should be taken into account to determine when to stop testing 
→ technical risk, business risk, project constraints 
What is the process of analyzing and removing causes of failures in software 
→ debugging 
Which of the following are MAJOR test implementation and execution tasks 
→ repeating test activities, creating test suites, reporting discrepancies, logging the 
outcome 
What pr...
IPC-A-610H 1 GENERAL - VOCABULARY ONLY QUESTIONS AND ANSWERS 2024/2025
primary side 
→ defined by master drawing; 
→ typically most complex side; 
→ aka "component side" or "solder destination side" 
secondary side 
→ side opposite of primary side 
solder source side 
→ side on which solder is applied; 
→ typically secondary side 
solder destination side 
→ side toward which solder flows; 
→ typically primary side 
cold solder connection 
→ exhibits poor wetting; 
→ characterized by gray, porous appearance; 
→ **Not Caused by Motio...
- Exam (elaborations)
- • 6 pages •
primary side 
→ defined by master drawing; 
→ typically most complex side; 
→ aka "component side" or "solder destination side" 
secondary side 
→ side opposite of primary side 
solder source side 
→ side on which solder is applied; 
→ typically secondary side 
solder destination side 
→ side toward which solder flows; 
→ typically primary side 
cold solder connection 
→ exhibits poor wetting; 
→ characterized by gray, porous appearance; 
→ **Not Caused by Motio...
IPC-A-610H 3 HANDLING ELECTRONIC ASSEMBLIES QUESTIONS AND ANSWERS 2024/2025
IPC-A-610H 3 HANDLING ELECTRONIC 
ASSEMBLIES QUESTIONS AND ANSWERS 
2024/2025
- Exam (elaborations)
- • 3 pages •
IPC-A-610H 3 HANDLING ELECTRONIC 
ASSEMBLIES QUESTIONS AND ANSWERS 
2024/2025
IPC-A-610 TEST QUESTIONS AND ANSWERS 2024/2025
3 types of Conformal Coating: Acrylic Resin (AR) 
→ This type of coating provides FAIR elasticity and general protection. It has high 
dielectric strength, and fair moisture and abrasion resistance. This coating is different 
from others because its facility for removal. This type are EASILY and quickly removed 
by a variety of solvents, often without requiring agitation. This makes rework and field 
repair very practical and economical. This type doesn't protect against solvents and 
...
- Exam (elaborations)
- • 8 pages •
3 types of Conformal Coating: Acrylic Resin (AR) 
→ This type of coating provides FAIR elasticity and general protection. It has high 
dielectric strength, and fair moisture and abrasion resistance. This coating is different 
from others because its facility for removal. This type are EASILY and quickly removed 
by a variety of solvents, often without requiring agitation. This makes rework and field 
repair very practical and economical. This type doesn't protect against solvents and 
...
IPC A 610 QUESTIONS AND ANSWERS 2024/2025
Class 1 Product 
→ General Electronics Product - includes products where the major requirement is function 
of the completed assembly. 
Class 2 Produc
- Exam (elaborations)
- • 8 pages •
Class 1 Product 
→ General Electronics Product - includes products where the major requirement is function 
of the completed assembly. 
Class 2 Produc
IPC-A-610 | CHAPTER 8 QUESTIONS AND ANSWERS 2024/2025
Staking Adhesive - Component Bonding 
Acceptable - Class 1 
Process Indicator - Class 2 
→ Adhesive material extending from under the component is visible in the termination 
area, but end joint width meets minimum requirements 
Staking Adhesive - Component Bonding 
Defect - Class 3 
→ Adhesive materials extending from under the component are visible in the termination 
area 
Staking Adhesive - Mechanical Strength 
Acceptable - Class 1,2,3 
→ - On round components adhesive adheres to a m...
- Exam (elaborations)
- • 20 pages •
Staking Adhesive - Component Bonding 
Acceptable - Class 1 
Process Indicator - Class 2 
→ Adhesive material extending from under the component is visible in the termination 
area, but end joint width meets minimum requirements 
Staking Adhesive - Component Bonding 
Defect - Class 3 
→ Adhesive materials extending from under the component are visible in the termination 
area 
Staking Adhesive - Mechanical Strength 
Acceptable - Class 1,2,3 
→ - On round components adhesive adheres to a m...
IPC-A-610 REV G QUESTIONS AND ANSWERS 2024/2025
Flexible and Rigid-Flex Printed Circuitry - Solder Wicking -> Defect Class 1, 2, 3 
→ Spacing as a result of solder wicking or plating migration violate minimum electrical 
clearance 
Attachment -> Acceptable Class 1 
→ Side overhang of flex 10-27 
Attachment -> Acceptable Class 2,3 
→ Side overhang10-27 
Attachme 
→ Wetted solder is visible in 10-27 
Marking 
→ Provides both product identification and traceability 
Marking - Etched - Acceptable Class 1,2,3 
→ Lines of a nu...
- Exam (elaborations)
- • 12 pages •
Flexible and Rigid-Flex Printed Circuitry - Solder Wicking -> Defect Class 1, 2, 3 
→ Spacing as a result of solder wicking or plating migration violate minimum electrical 
clearance 
Attachment -> Acceptable Class 1 
→ Side overhang of flex 10-27 
Attachment -> Acceptable Class 2,3 
→ Side overhang10-27 
Attachme 
→ Wetted solder is visible in 10-27 
Marking 
→ Provides both product identification and traceability 
Marking - Etched - Acceptable Class 1,2,3 
→ Lines of a nu...
INTRODUCTION TO ANATOMY AND PHYSIOLOGY- HC21 QUESTIONS AND ANSWERS 2024/2025
Anatomy 
→ study of an organism's body structure and their location 
Physiology 
→ study of the functions of each body part 
Why is it important? 
→ - teaches you how the body works 
→ - need to know what is happening with the pt 
how many levels are there for structural organization? 
→ 6 levels 
what do you need to build a cell? 
→ molecule 
molecules 
→ form when 2 or more atoms form chemical bonds with each other 
what is a cell? 
→ smallest structural unit of all living t...
- Exam (elaborations)
- • 21 pages •
Anatomy 
→ study of an organism's body structure and their location 
Physiology 
→ study of the functions of each body part 
Why is it important? 
→ - teaches you how the body works 
→ - need to know what is happening with the pt 
how many levels are there for structural organization? 
→ 6 levels 
what do you need to build a cell? 
→ molecule 
molecules 
→ form when 2 or more atoms form chemical bonds with each other 
what is a cell? 
→ smallest structural unit of all living t...
CCIM 101 Financial Analysis Questions and Correct Answers
MED SURG RN HESI EXAM | QUESTIONS & ANSWERS (VERIFIED) | LATEST UPDATE | GRADED A+