IPC-A-610 | Chapter 8 Questions and Correct Answers the Latest Update and Recommended Version
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Course
IPC-A-610
Institution
IPC-A-610
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2
Adhesive material extending from under the component is visible in the termination area,
but end joint width meets minimum requirements
Staking Adhesive - Component Bonding
Defect - Class 3
Adhesive mate...
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IPC-A-610 | Chapter 8 Questions and
Correct Answers the Latest Update and
Recommended Version
Staking Adhesive - Component Bonding
Acceptable - Class 1
Process Indicator - Class 2
✓ Adhesive material extending from under the component is visible in the termination area,
but end joint width meets minimum requirements
Staking Adhesive - Component Bonding
Defect - Class 3
✓ Adhesive materials extending from under the component are visible in the termination
area
Staking Adhesive - Mechanical Strength
Acceptable - Class 1,2,3
✓ - On round components adhesive adheres to a minimum 25% of the component height
✓ - On round components a minimum of three beads of staking material placed
approximately evenly around the periphery of the component
✓ - Slight flow under the component body does not damage the components or affect form,
fit and function
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✓ On round components there are less than three beads of staking material
Staking Adhesive - Mechanical Strength
Defect - Class 1,2,3
✓ Adhesive is not completely cured and homogemous
QUESTION**: SMT Leads - Plastic Components
✓ Unless otherwise specified, solder shall not touch a package body or seal. Expectations
are when a copper lead or termination configuration causes the solder fillet to contact a
plastic component body, such as:
✓
✓ - Plastic SOIC family (small outline packages such as SOT, SOD)
SMT Leads - Damage
Defect - Class 1,2,3
✓ Lead is damaged or deformed more than 10% of the diameter, width or thickness of the
lead
SMT Leads - Flattening
Acceptable - Class 1,2
Defect - Class 3
✓ The thickness of the flattened lead is less than 40% of the original diameter
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✓ - Components with surface and/or termination ends or sides that are not wettable by
design are exempt from solder wetting requirements in those areas. Solder fillet wetting
to the sides or ends of the leads is not required unless specifically stated.
✓ - Solder fillet may extend through the top bend. Solder should not extend under the body
or surface mount components whose leads are made of Alloy 42 or similar metals.
SMT Connections
Acceptable - Class 1,2,3
✓ Component titled/raised does not affect form, fit or function
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 1,2
✓ Side overhang (A) is less than or equal to 50% width of component termination area
(W) or 50% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - Side Overhang (A)
Acceptable - Class 3
✓ Side overhang (A) is less than or equal to 25% width of component termination area
(W) or 25% width of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
Acceptable - Class 1,2
✓ Minimum end joint width (C) is 50% width of component termination (W) or 50% width
of land (P), whichever is less
Chip Components - Bottom Only Terminations - End Joint Width (C)
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