IPC-A-610 - Chapter 7 Exam Questions With Certified Answers Graded A+
Through-Hole Technology - Answer-- The placement of any component on the electronic assembly does not prevent the insertion or removal of any hardware (tool clearance included) used to mount the assembly
- Bonding material is...
Through-Hole Technology - Answer-- The placement of any component on the
electronic assembly does not prevent the insertion or removal of any hardware (tool
clearance included) used to mount the assembly
- Bonding material is sufficient to hold the part but does not encapsulate and cover
component identification
/.Connection Mounting - Orientation - Answer-Inspection usually starts with a general
overall view of the electronic assembly, then follows each component/wire to its
connection, concentrating on the lead into the connection, the connection and the tail
end of the lead/wire leaving the connection. The wire/lead protrusion step for all lands
should be saved for last so that the board can be flipped over and all connections
checked together.
/.*Component Mounting - Orientation - Horizontal
Target - Class 1,2,3 - Answer-Nonpolarized components are oriented so that markings
are read the same way (left-to-right or top-to-bottom)
/.Component Mounting - Orientation - Vertical
Acceptable - Class 1,2,3 - Answer-- Polarized part is mounted with a long ground lead
- Nonpolarized component markings read from bottom to top
/.Component Mounting - Lead Forming
Defect - Class 1,2,3 - Answer-Lead is kinked
/.Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Acceptable - Class 1,2,3 - Answer-Leads of through-hole mounted component extend at
least one diameter or thickness but not less than 0.8 mm [0.03 in] from the body, solder
bead, or lead weld
/.Component Mounting - Lead Forming - Space between Seal/Weld and Bend
Defect - Class 1,2,3 - Answer-Fractured lead weld, solder bead, or component body
lead seal
/.Component Mounting - Lead Forming - Stress Relief - Answer-- With camel hump
bends. Configuration incorporating a single camel hump may have the body positioned
off-center.
, - Loop bends may be used if the location of the mounting holes prevents the use of a
standard bend if there is no possibility of shortening the lead to any adjacent component
lead or conductor. Use of loop bends may impact circuit impedance, etc., and shall be
approved by design engineering
/.Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1,2,3 - Answer-- Component lead exiting component body is
approximately parallel to major body axis
- Component centering may be offset as a result of the type of stress relief bond
/.Component Mounting - Lead Forming - Stress Relief
Acceptable - Class 1
Process Indicator - Class 2
Defect - Class 3 - Answer-Lead bends less than one diameter or thickness but less than
0.8mm [0.03 in] away from body seal
/.Component Mounting - Lead Forming - Damage
Acceptable - Class 1,2,3 - Answer-No nicks or deformation exceeding 10% of the
diameter, width or thickness of the lead
/.Component Mounting - Lead Forming - Damage
Defect - Class 1,2,3 - Answer-Heavy indentations such as serrated pliers mark
/.Component Mounting - Leads Crossing Conductors
Acceptable - Class 1,2,3 - Answer-- Sleeve does not interfere with formation of the
required solder connection
- Sleeve covers area of protection designated
/.Component Mounting - Leads Crossing Conductors
Not Established - Class 1
Defect - Class 2,3 - Answer-Splitting and/or unraveling of sleeving
/.Component Mounting - Leads Crossing Conductors
Defect - Class 2,3 - Answer-A component lead crossing an electrically noncommon
conductor violates minimum electrical clearance
/.Component Mounting - Hole Obstruction
Process Indicator - Class 2
Defect - Class 3 - Answer-Parts and components obstruct solder flow onto the primary
side (solder destination side) lands of plated through-holes required to be soldered
/.Component Mounting - DIP/SIP Devices and Sockets
Acceptable - Class 1,2,3 - Answer-Amount of tilt is limited by minimum lead protrusion
and height requirements
/.Component Mounting - DIP/SIP Devices and Sockets
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