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IPC J – STD 001G EXAM LATEST UPDATED

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IPC J – STD 001G EXAM LATEST UPDATED...

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  • September 24, 2024
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  • IPC J – STD 001G
  • IPC J – STD 001G
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IPC J – STD 001G EXAM LATEST
UPDATED


Conductor Diameter refers to the outside diameter of the wire, whether stranded
or solid, without insulation.

Wire Diameter

the outside diameter of the wire, whether stranded or solid, including insulation
if present.


Disposition

Determining how to treat faults. These include, but are not limited to: rework,
use as is, scrap, and repair.


Electrical Clearance

The minimum separation between non-common uninsulated wires is specified
in the applicable design standard or approved or controlled paperwork.

Foreign Object Debris (
FOD)

A generic term for any substance, debris, particle matter, or object that is not
part of the assembly or system.

High voltage.

This term will change according on design and application. The requirements in
this document are only applicable when clearly stated in the
drawings/procurement papers.

, Manufacturer (assembler)

The individual, organization, or firm in charge of the assembly process and
verification procedures required to guarantee that assemblies fully comply with
this Standard.




Objective Evidence

Documentation in physical paper, computer data, video, or other media
demonstrating that the Standard's requirements have been met.


Process Control

A strategy or approach for consistently steering an operation toward reducing
variation in processes or products to meet or surpass quality and performance
goals.


Proficiency

The ability to complete tasks by the standards and verification processes
specified in this Standard.

Solder the destination side.

In a plated through-hole application, the solder flows toward one side of the
printed circuit board (PCB).


Solder the source side.

The side of the PCB on which solder is put.

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